Joining method, apparatus of manufacturing joined body, joined body, ink jet head unit, and ink jet type recording apparatus

ABSTRACT

A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

BACKGROUND

1. Technical Field

The present invention relates to a joining method, an apparatus ofmanufacturing a joined body, a joined body, an ink jet head unit, and anink jet type recording apparatus.

2. Related Art

An adhesive has been widely used for joining of various members.However, in joining of members such as constituent components of an inkjet head which have a minute structure, when the adhesive overflows froma target portion, the overflow has a significant adverse effect on theperformance of a joined body, and the like.

To solve the problem, a method in which an adhesive is applied onto afilm, and then the adhesive is transferred to a member to be joined hasbeen used (for example, refer to JP-A-2009-136762).

However, in the method of the related art, it is difficult tosufficiently prevent the above-described problem from occurring.

SUMMARY

An advantage of some aspects of the invention is to provide a joiningmethod capable of efficiently manufacturing a joined body that is joinedby selectively applying a joining material to a target portion, anapparatus of manufacturing a joined body which is capable of efficientlymanufacturing the joined body that is joined by selectively applying thejoining material to the target portion, a joined body that is joined byselectively applying the joining material to the target portion, an inkjet head unit provided with the joined body that is joined byselectively applying the joining material to the target portion, and anink jet type recording apparatus.

An aspect of the invention is directed to a joining method includingapplying a joining material including a thermosetting resin to a member.The joining material includes an addition-type silicone resin.

With this configuration, it is possible to provide a joining methodcapable of efficiently manufacturing a joined body that is joined byselectively applying the joining material to the target portion.

In the joining method according to the aspect of the invention, it ispreferable that the joining material includes one or more kinds selectedfrom the group consisting of a methyl-based straight silicone resin, aphenyl-based silicone resin, and a modified silicone resin.

With this configuration, in the joined body that is finally obtained, anoperation of mitigating stress that occurs between a first member and asecond member is further enhanced, and thus peeling strength becomeshigh. Accordingly, it is possible to further enhance joiningreliability. In addition, degassing and curing shrinkage during a curingreaction further decrease. In addition, it is possible to furtherenhance water resistance, solvent resistance, ink resistance, and thelike of a joint portion that is formed using the joining material, andthus it is possible to further decrease a swelling ratio of the jointportion. According to this, the joining method may be appropriatelyapplied to manufacturing of a joined body that comes into contact with aliquid.

In the joining method according to the aspect of the invention, it ispreferable that a portion of the member, to which the joining materialis applied, is adjacent to a portion having a tubular structure.

In a case of joining the member having the above-described structure, aproblem related to overflow of a joining material which occurred due tothe capillary phenomenon (capillary effect) was more significant in therelated art. However, in the aspect of the invention, even when joininga member having the above-described structure, it is possible toeffectively prevent the above-described problem from occurring. That is,in a case where the portion of the first member, to which the joiningmaterial is applied, is adjacent to a portion having a tubularstructure, the effect of the invention is more significantly exhibited.

In the joining method according to the aspect of the invention, it ispreferable that a joined body is an ink jet head.

The ink jet head has a minute structure, and is particularly susceptibleto an effect due to overflow of the joining material (joint portion)from the target portion. Particularly, in an ink flow channel of the inkjet head, when the overflow of the joining material (joint portion)occurs from the target portion, the following problem and the likeoccur. Specifically, the joint portion may swell due to the ink, andthus the joining strength of the joint portion may decrease, or inkejection stability may decrease due to deformation of the ink jet head.In addition, even when the joining material is a water-repellentmaterial, and the problem related to the swelling due to the ink doesnot occur, if overflow of the joining material (joint portion) from thetarget portion occurs in an ink flow channel of the ink jet head, theportion is apt to repel the ink, and thus there is a problem in that theink ejection stability also decreases. In contrast, in the aspect of theinvention, it is possible to selectively provide the joint portion tothe target portion. Accordingly, even when the invention is applied tothe inkjet head, it is possible to effectively prevent the occurrence ofthe above-described problem in advance. As a result, in a case where theinvention is applied to the inkjet head, the effect of the invention ismore significantly exhibited.

Another aspect of the invention is directed to an apparatus ofmanufacturing a joined body using the joining method according to theaspect of the invention.

With this configuration, it is possible to provide an apparatus ofmanufacturing a joined body which is capable of efficientlymanufacturing the joined body that is joined by selectively applying thejoining material to the target portion.

Still another aspect of the invention is directed to a joined body thatis manufactured using the joining method according to the aspect of theinvention.

With this configuration, it is possible to provide a joined body that isjoined by selectively applying the joining material to the targetportion.

Yet another aspect of the invention is directed to a joined body that ismanufactured using the manufacturing apparatus according to the aspectof the invention.

With this configuration, it is possible to provide a joined body that isjoined by selectively applying the joining material to the targetportion.

It is preferable that the joined body according to the aspect of theinvention is an ink jet head.

The ink jet head has a minute structure, and is particularly susceptibleto an effect due to overflow of the joining material (joint portion)from the target portion. Particularly, in an ink flow channel of the inkjet head, when the overflow of the joining material (joint portion)occurs from the target portion, the following problem and the likeoccur. Specifically, the joint portion may swell due to the ink, andthus the joining strength of the joint portion may decrease, or inkejection stability may decrease due to deformation of the ink jet head.In addition, even when the joining material is a water-repellentmaterial, and the problem related to the swelling due to the ink doesnot occur, if overflow of the joining material (joint portion) from thetarget portion occurs in an ink flow channel of the ink jet head, theportion is apt to repel the ink, and thus there is a problem in that theink ejection stability also decreases. In contrast, in the aspect of theinvention, it is possible to selectively provide the joint portion tothe target portion. Accordingly, even when the invention is applied tothe inkjet head, it is possible to effectively prevent the occurrence ofthe above-described problem in advance. As a result, in a case where theinvention is applied to the ink jet head, the effect of the invention ismore significantly exhibited.

Still yet another aspect of the invention is directed to an ink jet headunit including an ink jet head that is the joined body according to theaspect of the invention.

With this configuration, it is possible to provide an ink jet head unitprovided with the joined body (ink jet head) that is joined byselectively applying the joining material to the target portion.

Further another aspect of the invention is directed to an ink jet typerecording apparatus including the ink jet head unit according to theaspect of the invention.

With this configuration, it is possible to provide an ink jet typerecording apparatus provided with the joined body (ink jet head) that isjoined by selectively applying the joining material to the targetportion.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a cross-sectional view schematically illustrating a preferredembodiment of an apparatus of manufacturing a joined body according tothe invention.

FIG. 2 is a cross-sectional view schematically illustrating a preferredembodiment of an ink jet head to which the invention is applied.

FIG. 3 is a cross-sectional view schematically illustrating anotherpreferred embodiment of the ink jet head to which the invention isapplied.

FIG. 4 is a bottom view of a case of the ink jet head illustrated inFIG. 3.

FIG. 5 is a schematic view illustrating a preferred embodiment of an inkjet type recording apparatus according to the invention.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, preferred embodiments of the invention will be described indetail with reference to the attached drawings.

Apparatus of Manufacturing Joined Body, and Joining Method

First, an apparatus of manufacturing a joined body according to theinvention, and a joining method will be described.

The joining method according to the invention includes a process ofapplying a joining material including a thermosetting resin to a member,and the joining material includes an addition-type silicone resin.

As a method of applying the joining material, various methods such as astamping method and brush application may be employed.

In addition, as the method of applying the joining material, a transfermethod may also be employed.

In the following description, description will be mainly given to a caseof applying the joining material by the transfer method.

FIG. 1 is a cross-sectional view schematically illustrating a preferredembodiment of an apparatus of manufacturing the joined body according tothe invention.

As illustrated in FIG. 1, the apparatus M100 of manufacturing the joinedbody P10 includes a joining material accommodating section M8 in which ajoining material P3 including a thermosetting resin is accommodated, afilm forming section M1 in which the joining material P3 in a heatedstate is applied onto a transfer medium P4 to form a film, a secondheating treatment section M2 in which the joining material P3 that isapplied to the transfer medium P4 is subjected to a second heatingtreatment, a transfer section M3 in which the joining material P3subjected to the second heating treatment is transferred to a firstmember P1, a third heating treatment section M4 in which the transferredjoining material P3 is subjected to a third heating treatment in a statein which the transferred joining material P3 is interposed between thefirst member P1 and a second member P2, a transporting unit M5 thattransports the first member P1, a roller (feeding roller) M6 that feedsthe transfer medium P4, and a roller (winding roller) M7 that winds thetransfer medium P4.

In addition, a film forming process is performed in the film formingsection M1, a second heating treatment process is performed in thesecond heating treatment section M2, a transfer process is performed inthe transfer section M3, and a third heating treatment process isperformed in the third heating treatment section M4.

The film forming section M1 is a region in which the film formingprocess is performed.

The film forming section M1 includes a first heating unit (heater, aviscosity lowering unit) M14 that heats the joining material P3 suppliedfrom the joining material accommodating section M8, a joining materialapplying unit M11 that applies the joining material P3 in a heated stateto the transfer medium P4, a planarization unit (squeegee) M12, thatplanarizes the joining material P3 applied by the joining materialapplying unit M11 into a film shape, and a supporting member (supportingstage) M13 that supports the transfer medium P4 during planarizationfrom a surface side opposite to a surface side in which theplanarization unit (squeegee) M12 is provided.

The first heating unit (heater, viscosity lowering unit) M14 has afunction of heating the joining material P3 in advance prior toapplication of the joining material P3 from the joining materialapplying unit M11.

According to this, viscosity of the joining material P3 decreases, andthus it is possible to appropriately perform application of the joiningmaterial P3 from the joining material applying unit M11. Particularly,the joining material P3 can be formed into a film having a smallthickness as described below. In contrast, in a case of applying ajoining material, which is not heated, onto a transfer medium, theviscosity of the joining material is not appropriately adjusted, andthus it is difficult to achieve sufficiently excellent uniformity in thefilm thickness of the joining material that is formed. Particularly, ina case where the thickness of a film to be formed is small as describedbelow, the above-described tendency becomes significant.

In addition, in this embodiment, heating of the joining material P3 isperformed in the film forming section M1 (film forming process). Inother words, film formation of the joining material P3 is performedwhile performing a first heating treatment in the film forming sectionM1 (film forming process), and thus the film forming section M1 alsofunctions as a first heating treatment section. The invention may have aconfiguration in which a joining material in a heated state is appliedonto the transfer medium. For example, a configuration in which ajoining material in a stored state is heated and heating is notperformed during film formation is possible. In addition, a joiningmaterial that is heated may be supplied to a manufacturing apparatus,and manufacturing of the joined body may be performed using the joiningmaterial (the first heating unit may not be provided). However, as isthe case with this embodiment, when heating of the joining material P3is performed during film formation, it is possible to more accuratelyperform adjustment of the viscosity of the joining material P3, and thelike during film formation. In addition, it is possible to moreeffectively prevent unintentional modification (including a partialcuring reaction of the thermosetting resin) of the joining material P3.

The planarization unit (squeegee) M12 has a function of planarizing thejoining material P3, which is applied by the joining material applyingunit M11, into a film shape.

The supporting member (supporting stage) M13 has a function ofsupporting the transfer medium P4 from a surface side opposite to asurface side in which the planarization unit (squeegee) M12 is providedwhen planarization is performed.

According to this, it is possible to effectively prevent unintentionaldeformation (bending) of the transfer medium P4 during a film formingprocess, and thus it is possible to more reliably achieve highuniformity in the film thickness of a film to be formed from the joiningmaterial P3.

The joining material P3 includes a thermosetting resin.

Examples of the thermosetting resin that constitutes the joiningmaterial P3 include a silicone rubber, an addition-type silicone resin,a condensation type silicone resin, an epoxy resin, an acrylic resin,and the like. Among these, the addition-type silicone resin ispreferable.

According to this, in the joined body P10 that is finally obtained, anoperation of mitigating stress that occurs between the first member P1and the second member P2 becomes strong, and thus peeling strengthbecomes high. As a result, it is possible to further enhance joiningreliability.

In addition, degassing and curing shrinkage during a curing reactiondecrease.

In addition, it is possible to further enhance water resistance, solventresistance, ink resistance, and the like of the joint portion P5 that isformed using the joining material P3, and thus it is possible make aswelling ratio of the joint portion P5 become small. According to this,the joining method may be appropriately applied to manufacturing of thejoined body P10 that comes into contact with a liquid.

Examples of the addition-type silicone resin include a straight siliconeresin such as a methyl-based silicone resin, a phenyl-based siliconeresin, and methylphenyl-based silicone resin; a modified silicone resinsuch as a alkyd modified silicone resin, an epoxy modified siliconeresin, an acrylic modified silicone resin, and a polyester modifiedsilicone resin; and the like. However, one or more kinds selected fromthe group consisting of the methyl-based straight silicone resin, thephenyl-based silicone resin, and the modified silicone resin arepreferable, and the methyl-based straight silicone resin is morepreferable.

According to this, the above-described effects are more significantlyexhibited.

The joining material P3 may include components (other components) otherthan the thermosetting resin. Examples of the components include asolvent, a curing agent, a cross-linking agent, a catalyst, apolymerization initiator, a polymerization inhibitor, a coloring agent,an oxidation inhibitor, a preservative, an antifungal agent, and thelike.

As a catalyst, for example, a Pt catalyst, an Al complex, an Fe complex,a rhodium complex, and the like may be used.

When the polymerization inhibitor is included, it is possible toeffectively prevent an unintentional polymerization reaction of thethermosetting resin that constitutes the joining material P3 fromproceeding before film formation in the film forming section M1 (filmforming process), and adjustment of a degree of curing (degree ofpolymerization) during the second heating treatment becomes easy.

It is preferable that the temperature of the joining material P3 in thefilm forming process is 40° C. to 80° C.

According to this, it is possible to more appropriately lower theviscosity of the joining material P3 in the film forming process whilemore effectively preventing the unintentional modification (including apartial curing reaction of the thermosetting resin) of the joiningmaterial P3.

It is preferable that the viscosity of the joining material P3 in thefilm forming process is 100 Pa·s or less.

According to this, flowability of the joining material P3 in the filmforming process is further enhanced, and thus even when a film to beformed is relatively thin, it is possible to form the film with higherthickness uniformity.

In addition, in this specification, the viscosity represents a value,which is obtained by measurement under conditions of tool: TAinstrument/ARES-2K, a measurement mode: a time sweep test with parallelplate φ25 mm, a measurement frequency: 1 Hz, an applied strain: 1.0%,and a density value used in measurement: 1.00 g/cc, unless otherwisestated.

The transfer medium P4 is configured to be wound around the roller(winding roller) M7 after feeding by the roller (feeding roller) M6. Anoperation of the roller may be appropriately performed, for example, bya motor.

Examples of a constituent material of the transfer medium P4 includepolyethylene terephthalate, a tetrafluoroethylene-perfluoroalkyl vinylether copolymer (PFA), a tetrafluoroethylene-hexafluoropropylenecopolymer (FEP), polychlorotrifluoroethylene (PCTFE), a cycloolefinpolymer (COP), a tetrafluoroethylene-ethylene copolymer (ETFE), and thelike, but among these, the polyethylene terephthalate is preferable.

The polyethylene terephthalate is relatively cheap and has appropriateflexibility, and thus handling properties (easiness of handling) thereofare excellent.

According to this, mold release properties of the joining material P3become excellent, and thus it is possible to more smoothly perform atreatment in a transfer process. Accordingly, it is possible to furtherenhance productivity of the joined body P10.

The thickness of the transfer medium P4 is not particularly limited, buta thickness of 10 μm to 2000 μm is preferable.

The film thickness of the joining material P3 that is formed in the filmforming process is preferably 0.5 μm to 6.0 μm.

According to this, in the joined body P10 that is finally obtained, itis possible to more effectively prevent overflow of the joint portion P5from the target portion, and the like, and it is possible to furtherenhance joining strength of the joined body P10.

The second heating treatment section M2 is a region in which a secondheating process is performed.

When the second heating treatment is performed, a curing reaction of thethermosetting resin partially progresses (thermosetting resin istemporarily cured), and thus the viscosity of the joining material P3increases. Accordingly, shape stability is improved. As a result, in thesubsequent transfer process, it is possible to effectively preventunintentional deformation of the joining material P3, and the like, andthus the joining material P3 can be transferred with a desired shape anda desired pattern. As a result, in the joined body P10 that is finallyobtained, it is possible to selectively provide the joint portion P5 atthe target portion.

The second heating treatment section M2 is provided with a secondheating unit (heater, temporary curing unit) M21 that heats the joiningmaterial P3 on the transfer medium P4.

In the configuration that is illustrated, the second heating unit M21 isprovided on an outer surface side (on a surface side opposite to asurface facing the transfer medium P4) of the joining material P3 on thetransfer medium P4, and heating is performed from the surface side.However, a portion at which the second heating unit M21 is provided isnot particularly limited, and may be a surface side (rear surface side)opposite to a surface of the transfer medium P4 to which joiningmaterial P3 is applied. In addition, a plurality of the second heatingunits M21 may be used, and for example, the second heating unit M21 maybe disposed on both-surface sides of the transfer medium P4 to which thejoining material P3 is applied.

It is preferable that the heating temperature in the second heatingtreatment is 60° C. to 120° C.

According to this, it is possible to further enhance joining strengthwith the second member P2 in a third heating process while furtherenhancing shape stability of the joining material P3 after the secondheating treatment. In addition, it is possible to relatively shorten atreatment time in the second heating treatment, and thus it is possibleto further enhance productivity of the joined body P10.

In addition, it is preferable that a heating time in the second heatingtreatment is 2 minutes to 10 minutes.

According to this, it is possible to further enhance joining strengthwith the second member P2 in the third heating process while furtherenhancing shape stability of the joining material P3 after the secondheating treatment. In addition, it is possible to further enhanceproductivity of the joined body P10.

In addition, the second heating treatment may be performed underconstant conditions, or the conditions may be changed during thetreatment.

The transfer section M3 is a region in which a transfer process isperformed.

The viscosity of the joining material P3 that is transferred in thetransfer process increases due to the above-described second heatingtreatment, and thus the shape stability is improved. Accordingly, in thetransfer process, it is possible to effectively prevent unintentionaldeformation of the joining material P3 and the like in the transferprocess, and thus the joining material P3 can be transferred with adesired shape and a desired pattern. As a result, in the joined body P10that is finally obtained, it is possible to selectively provide thejoint portion P5 at the target portion. In addition, the shape stabilityof the joining material P3 is improved, and thus even when the joiningmaterial P3 and the first member P1 are brought into close contact witheach other at relatively high pressure in the transfer process, it ispossible to effectively prevent unintentional deformation of the joiningmaterial P3. Accordingly, in a state after the joining material P3 istransferred, it is possible to further enhance adhesiveness between thefirst member P1 and the joining material P3 that is transferred, andthus it is possible to effectively prevent an unintentional gap and thelike from occurring between the first member P1 and the joining materialP3. As a result, it is possible to further enhance joining reliabilitybetween the first member P1 and the joint portion P5 in the joined bodyP10, and thus it is possible to further enhance durability andreliability of the joined body P10 as a whole.

The transfer section M3 is provided with a pressing unit M31 thatpresses the transfer medium P4 in order for the joining material P3subjected to the second heating treatment and the first member P1 tocome into contact with each other, and a supporting member (transferstage) M32 that supports the first member P1 during transfer of thejoining material P3 to the first member P1 from a surface side oppositeto a surface side at which the pressing unit M31 is provided.

Pressurization performed by the pressing unit M31 is performed in astate in which alignment is performed in order for the joining materialP3, which is to be transferred, on the transfer medium P4, and thetarget portion (portion at which the joint portion P5 is to be formed)of the first member P1 to come into contact with each other.

It is preferable that the viscosity of the joining material P3 in thetransfer process is 300 Pa·s to 10000 Pa·s.

According to this, it is possible to more reliably prevent unintentionaldeformation of the joining material P3 in the transfer process, and thusit is possible to more effectively prevent overflow of the joint portionP5 from the target portion, and the like in the joined body P10 that isfinally obtained.

It is preferable that the thickness of the joining material P3 that istransferred is 0.5 μm to 3.0 μm.

According to this, in the joined body P10 that is finally obtained, itis possible to more effectively prevent overflow of the joint portion P5from the target portion, and the like, and it is possible to furtherenhance joining strength of the joined body P10.

It is preferable that a pressure (pressing force) when the joiningmaterial P3 and the first member P1 are brought into close contact witheach other is 0.1 MPa to 100 MPa.

As described above, when the pressing force is set to be relativelylarge, it is possible to further enhance adhesiveness between thejoining material P3 and the first member P1. In addition, since thesecond heating process is performed prior to the transfer process, evenwhen the pressing force is set to be relatively large, the unintentionaldeformation of the joining material P3 is reliably prevented.Accordingly, in the joined body P10 that is finally obtained, it ispossible to more effectively prevent overflow of the joint portion P5from the target portion, and the like, and it is possible to furtherenhance joining strength of the joined body P10.

It is preferable that a width of a portion of the first member P1 towhich the joining material P3 is applied is 5.0 μm to 20 μm.

As described above, when the width of the portion (portion to be joined)to which the joining material is applied is small, a problem related tooverflow of the joining material and the like has occurred in therelated art. However, in the embodiment of the invention, even when thewidth of the portion (portion to be joined) to which the joiningmaterial is applied is sufficiently small, it is possible to effectivelyprevent occurrence of the above-described problem. That is, in a casewhere the width of the portion of the first member P1 to which thejoining material P3 is applied is a value in the above-described range,the effect of the invention is more significantly exhibited.

It is preferable that the portion of the first member P1 to which thejoining material P3 is applied is adjacent to a portion having a tubularstructure.

In a case of joining the member having the above-described structure,problems related to overflow of the joining material and the like moresignificantly occur due to a capillary phenomenon in the related art.However, in the embodiment of the invention, even when joining a memberhaving the above-described structure, it is possible to effectivelyprevent the above-described problem from occurring. That is, in a casewhere the portion of the first member P1, to which the joining materialP3 is applied, is adjacent to a portion having a tubular structure, theeffect of the invention is more significantly exhibited.

The third heating treatment section M4 is a region in which the thirdheating process is performed.

The thermosetting resin that constitutes the joining material P3 ismainly cured by the third heating treatment, and thus the joint portionP5 is formed. According to this, the joined body P10, in which the firstmember P1 and the second member P2 are connected to each other throughthe joint portion P5, is obtained.

In the joining material P3 that comes into contact with the secondmember P2, the thermosetting resin is temporarily cured by theabove-described second heating treatment, and thus the viscosity thereofincreases and shape stability is improved. Accordingly, unintentionaldeformation of the joining material P3 (joint portion P5) and the likedue to an increase in flowability of the joining material P3 areeffectively prevented during joining (third heating process) between thefirst member P1 and the second member P2, and thus it is possible toselectively provide the joint portion P5 at the target portion. Inaddition, the shape stability of the joining material P3 is improved,and thus even when the joining material P3 and the second member P2 arebrought into close contact with each other at a relatively highpressure, it is possible to effectively prevent unintentionaldeformation of the joining material P3. Accordingly, it is possible tofurther enhance adhesiveness between the second member P2 and the jointportion p5, and thus it is possible to effectively prevent anunintentional gap and the like from occurring between the second memberP2 and the joint portion P5. In addition, even when adhesiveness betweenthe first member P1 and the joining material P3 is not sufficient in theabove-described process, when the second member P2 and the joiningmaterial P3 are brought into close contact with each other at arelatively large pressure in the third heating process, adhesivenessbetween the first member P1 and the joining material P3 is alsoimproved. Accordingly, it is possible to further enhance joiningreliability between the second member P2 and the joint portion P5, andjoining reliability between the first member P1 and the joint portion P5in the joined body P10, and thus it is possible to further enhancedurability and reliability of the joined body P10 as a whole.

The third heating treatment section M4 is provided with a third heatingunit (heater, main curing unit) M41 that heats the joining material P3in a state of being interposed between the first member P1 and thesecond member P2, a pressing unit M42 that presses the second member P2in order for the joining material P3 transferred onto the first memberP1 and the second member P2 to come into contact with each other, and asupporting member M43 that supports the first member P1 in a pressedstate by the pressing unit M42.

In the configuration that is illustrated, the third heating unit M41 isintegrally provided with the pressing unit M42, and performs heating ona second member P2 side. However, a portion at which the third heatingunit M41 is provided is not particularly limited, and for example, thethird heating unit M41 may be provided independently from the pressingunit M42. In addition, for example, the third heating unit M41 may beprovided on a supporting member M43 side.

It is preferable that a pressure (pressing force) when the joiningmaterial P3 and the second member P2 are brought into close contact witheach other is 0.01 MPa to 10 MPa.

As described above, when the pressing force is set to be relativelylarge, it is possible to further enhance adhesiveness between thejoining material P3 and the second member P2, and adhesiveness betweenthe joining material P3 and the first member P1. In addition, since thesecond heating process is performed prior to the third heating process,even when the pressing force is set to be relative large, theunintentional deformation of the joining material P3 is reliablyprevented. Accordingly, in the joined body P10 that is finally obtained,it is possible to more effectively prevent overflow of the joint portionP5 from the target portion, and the like, and it is possible to furtherenhance joining strength in the joined body P10.

It is preferable that the heating temperature in the third heatingtreatment is 60° C. to 250° C.

According to this, it is possible to further enhance joining strength inthe joined body P10 while reliably preventing deterioration and the likeof constituent materials of the first member P1 and the second memberP2. In addition, it is possible to relatively shorten a treatment timein the third heating treatment, and thus it is possible to furtherenhance productivity of the joined body P10.

In addition, it is preferable that the heating time in the third heatingtreatment is 3 minutes to 60 minutes.

According to this, it is possible to further enhance the joiningstrength in the joined body P10 while reliably preventing deteriorationof the constituent materials of the first member P1 and the secondmember P2, and the like. In addition, it is possible to further enhanceproductivity of the joined body P10.

In addition, the third heating treatment may be performed under constantconditions, or the conditions may be changed during the treatment. Forexample, in the third heating treatment, a first step may be performedat a temperature of T₁ [° C.] and a pressure of P₁ [Pa], and then asecond step may be performed at a temperature of T₂ [° C.] which ishigher than T₁, and a pressure of P₂ [Pa] which is higher than P₁.

According to this, it is possible to further enhance joining reliabilitybetween the second member P2 and the joint portion P5, and joiningreliability between the first member P1 and the joint portion P5 in thejoined body P10 while more effectively preventing unintentionaldeformation of the joining material P3 (joint portion P5). Accordingly,it is possible to further enhance durability and reliability of thejoined body P10 as a whole.

According to the apparatus of manufacturing the joined body according tothe invention and the joining method, it is possible to efficientlymanufacture the joined body in which the joining material is selectivelyapplied to the target portion for joining.

Joined Body

Next, the joined body according to the invention will be described.

The joined body according to the invention is manufactured using thejoining method according to the invention, and the apparatus ofmanufacturing the joined body according to the invention as describedabove.

According to this, it is possible to provide a joined body that isjoined by selectively applying the joining material to the targetportion.

The joined body according to the invention may be an arbitrary article,but an ink jet head is preferable.

The ink jet head has a minute structure, and is particularly susceptibleto an effect due to overflow of the joining material (joint portion)from the target portion.

Particularly, in an ink flow channel of the ink jet head, when theoverflow of the joining material (joint portion) occurs from the targetportion, the following problem and the like occur. Specifically, thejoint portion may swell due to the ink, and thus the joining strength ofthe joint portion may decrease, or ink ejection stability may decreasedue to deformation of the ink jet head.

In addition, even when the joining material is a water-repellentmaterial, and the problem related to the swelling due to the ink doesnot occur, if overflow of the joining material (joint portion) from thetarget portion occurs in an ink flow channel of the ink jet head, theportion is apt to repel the ink, and thus there is a problem in that theink ejection stability also decreases.

In contrast, in the embodiment of the invention, it is possible toselectively provide the joint portion to the target portion.Accordingly, even when the invention is applied to the ink jet head, itis possible to effectively prevent occurrence of the above-describedproblem in advance.

As a result, in a case where the invention is applied to the ink jethead, the effect of the invention is more significantly exhibited.

Hereinafter, the invention will be described in detail with reference toa specific example in which the invention is applied to an ink jet head.

FIG. 2 is a cross-sectional view schematically illustrating a preferredembodiment of the ink jet head to which the invention is applied, FIG. 3is a cross-sectional view schematically illustrating another preferredembodiment of the ink jet head to which the invention is applied, andFIG. 4 is a bottom view of a case of the ink jet head illustrated inFIG. 3.

An ink jet head 100 illustrated in FIG. 2 includes a silicon substrate81 in which an ink reservoir 87 is formed, a vibrating plate 82 that isformed on the silicon substrate 81, a lower electrode 83 that is formedon a desired position on the vibrating plate 82, a piezoelectric thinfilm 84 that is formed on the lower electrode 83 at a positioncorresponding to the ink reservoir 87, an upper electrode 85 that isformed on the piezoelectric thin film 84, and a second substrate 86 thatis joined to the lower surface of the silicon substrate 81. The secondsubstrate 86 is provided with an ink ejecting nozzle 86A thatcommunicates with the ink reservoir 87.

In the ink jet head 100, ink is supplied to the ink reservoir 87 throughan ink flow channel (not illustrated). Here, a voltage is applied to thepiezoelectric thin film 84 through the lower electrode 83 and the upperelectrode 85, the piezoelectric thin film 84 is deformed and thus theinside of the ink reservoir 87 enters a negative pressure state, andthus a pressure is applied to the ink. Due to the pressure, the ink isejected from a nozzle, and ink jet recording is performed.

For example, the ink jet head 100 may have the following structure.Specifically, a Si thermal oxide film is set as the vibrating plate 82,and a thin film piezoelectric element including the lower electrode 83,the piezoelectric thin film 84, and the upper electrode 85 is integrallyformed on an upper portion of the vibrating plate 82 by a thin filmprocess. In addition, a chip including a single crystal siliconsubstrate 81 in which a cavity (ink reservoir) 87 is formed, and astainless steel nozzle plate (second substrate) 86 provided with the inkejecting nozzle 86A that ejects ink are joined by the joining methodaccording to the invention.

Here, as the piezoelectric thin film 84, for example, a thin filmconstituted by ternary PZT, which is a material having highpiezoelectric strain constant d31 and in which lead-magnesium niobate isadded as a third component, may be used to obtain a relatively largedisplacement amount. In addition, the thickness of the piezoelectricthin film 84 may be set to approximately 2 μm.

In a case where the invention is applied for joining of the constituentmembers of the ink jet head having the above-described structure, it ispossible to selectively apply the joining material to the targetportion, and thus reliability of the ink jet head (joined body) that isobtained increases.

In addition, the ink jet head 100 illustrated in FIGS. 3 and 4 includesa flow channel formed substrate 10 having pressure generating chambers11, a nozzle plate 20, in which a plurality of nozzles 21 respectivelycommunicating with the pressure generating chambers 11 are punched, anda vibrating member 15 that is joined to a surface of the flow channelformed substrate 10 on a side opposite to the nozzle plate 20. Inaddition, the ink jet head 100 of this embodiment includes apiezoelectric element unit 30 including a plurality of piezoelectricelements 35 provided in regions corresponding to the pressure generatingchambers 11 on the vibrating member 15, and a case 40 that is joined toone surface of the flow channel formed substrate 10 through thevibrating member 15. In addition, in this embodiment, a reservoir 13,which is a common liquid chamber of the pressure generating chambers 11,is formed in the flow channel formed substrate 10, and the flow channelformed substrate 10 is configured also as a reservoir formed substrate.

In the flow channel formed substrate 10, the pressure generatingchambers 11 are partitioned by a partition wall at a surface portion onone surface side of the flow channel formed substrate 10, and arearranged in parallel with each other in a width direction of the flowchannel formed substrate 10. In addition, in this embodiment, thepressure generating chambers 11 are formed in two rows each including aplurality of the pressure generating chamber 11 arranged in parallel. Inaddition, the reservoir 13, to which ink is supplied through an inkintroducing channel 41 that is a liquid introducing channel of the case40, is formed one by one on an outer side of each of the rows of thepressure generating chambers 11 to penetrate through the flow channelformed substrate 10 in a thickness direction thereof.

In addition, the reservoir 13 and each of the pressure generatingchambers 11 communicate with each other through an ink supply channel12, and ink is supplied to the pressure generating chamber 11 throughthe ink introducing channel 41, the reservoir 13, and the ink supplychannel 12. In this embodiment the ink supply channel 12 is formed witha width narrower than that of the pressure generating chamber 11, andplays a role of constantly retaining flow channel resistance of the inkthat is introduced from the reservoir 13 to the pressure generatingchamber 11.

In addition, a nozzle communication hole 14, which penetrates throughthe flow channel formed substrate 10, is formed on end side of thepressure generating chamber 11 which is opposite to the reservoir 13.That is, in this embodiment, the reservoir 13, the ink supply channel12, the pressure generating chamber 11, and the nozzle communicationhole 14 are provided to the flow channel formed substrate 10 as a liquidflow channel. In this embodiment, the flow channel formed substrate 10is configured by a silicon single crystal substrate, and the pressuregenerating chamber 11, the reservoir 13, and the like, which areprovided to the flow channel formed substrate 10, are formed by etchingthe flow channel formed substrate 10.

The nozzle plate 20, in which the plurality of nozzles 21 that eject inkare punched, is joined to one surface of the flow channel formedsubstrate 10, and each of the nozzles 21 communicates with each of thepressure generating chamber 11 through the nozzle communication hole 14that is provided to the flow channel formed substrate 10.

In addition, the vibrating member 15 is joined to the other surface ofthe flow channel formed substrate 10, that is, an opening surface of thepressure generating chamber 11 with an adhesive layer 17, and each ofthe pressure generating chambers 11 is sealed with the vibrating member15. In addition, as illustrated in the drawing, the vibrating member 15has an area that is approximately the same as an area of the othersurface of the flow channel formed substrate 10, and the joining of thevibrating member 15 is performed to cover the entirety of the othersurface of the flow channel formed substrate 10.

For example, the vibrating member 15 is formed as a composite plateincluding an elastic membrane 15 a constituted by an elastic member suchas a resin film, and a supporting plate 15 b which supports the elasticmembrane 15 a and is formed from a metallic material, and an elasticmembrane 15 a side is joined to the flow channel formed substrate 10. Inthis embodiment, the elastic membrane 15 a is constituted by apolyphenylene sulfide (PPS) film having a thickness of approximatelyseveral μm, and the supporting plate 15 b is constituted by stainlesssteel sheet (SUS) having a thickness of approximately several tens μm.

In addition, a region of the vibrating member 15, which faces aperipheral portion of each of the pressure generating chamber 11, isconfigured as a thin portion 15 d from which the supporting plate 15 bis removed and which is substantially constituted by only the elasticmembrane 15 a. The thin portion 15 d forms one surface of the pressuregenerating chamber 11. In addition, an island portion 15 c, which isconstituted by a part of the supporting plate 15 b with which a tip endof each of the piezoelectric elements 35 comes into contact, is providedon an inner side of the thin portion 15 d. In addition, a region of thevibrating member 15, which faces the reservoir 13, is configured as avibrating portion 16 from which the supporting plate 15 b is removed andwhich is constituted by only the elastic membrane 15 a. When a variationin a pressure inside the reservoir 13 occurs, the vibrating portion 16is deformed to perform a role of absorbing the pressure variation toconstantly retain the pressure inside the reservoir 13. In addition, thecase 40 is joined onto the vibrating member 15 with an adhesive layer18. That is, the case 40 of this embodiment is joined to the flowchannel formed substrate 10 through the vibrating member 15.

As illustrated in FIG. 3, the case 40 is provided with a space portion42 constituted by a concave portion at a position facing the vibratingportion 16. The space portion 42 has a height with which deformation ofthe vibrating portion 16 is not hindered, and the space portion 42communicates with an outer space through a case through-hole 44 that isa hole which penetrates through the case 40 and is opened to the air.According to this, the pressure inside the space portion 42 is alwaysretained constantly with that of an outer space. In addition, apiezoelectric element accommodating portion 43 consisting of apenetration portion that penetrates through the case 40, is provided tothe case 40 at a position facing the thin portion 15 d. In addition, astepped portion 45 is provided on an ink introducing channel 41 side ofthe piezoelectric element accommodating portion 43, and the followingfixing substrate 36 of the piezoelectric element unit 30 is joined tothe stepped portion 45.

In addition, a wiring substrate 70, which is provided with a pluralityof conductive pads 71 to which wiring layers 51 of the followingflexible printed substrate 50 are respectively connected, is fixed to asurface of the case 40 which is opposite to the flow channel formedsubstrate 10. A slit-shaped opening 72 is formed in the wiring substrate70 at a region facing the piezoelectric element accommodating portion 43of the case 40, and the piezoelectric element accommodating portion 43communicates with an outer space through the opening 72. In addition,the piezoelectric element unit 30 including the piezoelectric element 35is accommodated inside the piezoelectric element accommodating portion43.

The piezoelectric element unit 30 includes a plurality of thepiezoelectric elements 35 which are respectively provided to face thepressure generating chambers 11 and which change a pressure insideliquid flow channels including the pressure generating chamber 11 andthe reservoir 13, and the fixing substrate 36 that attaches thepiezoelectric elements 35 to the case 40.

In this embodiment, the piezoelectric elements 35 are integrally formedin one piezoelectric element unit 30. That is, a piezoelectric material31, and electrode forming materials 32 and 33 are alternately laminatedin a sandwich shape in a vertical direction to form a piezoelectricelement forming member 34, and the piezoelectric element forming member34 is divided into a comb teeth shape in correspondence with each of thepressure generating chambers 11 to form each of the piezoelectricelements 35. That is, in this embodiment, the plurality of piezoelectricelements 35 are integrally formed. In addition, a tip end of each of thepiezoelectric elements 35 is joined to an island portion 15 c of thevibrating member 15 with an adhesive (joining agent), and a base endthereof, which is configured as an inactive region not contributing tovibration, is fixed to the fixing substrate 36. As described above, thefixing substrate 36 to which the piezoelectric element 35 is fixed isjoined to the case 40 at the stepped portion 45 of the piezoelectricelement accommodating portion 43. According to this, the piezoelectricelement unit 30 is accommodated in the piezoelectric elementaccommodating portion 43 of the case 40 and is fixed thereto.

In addition, as described above, the fixing substrate 36 is providedintegrally with the piezoelectric element 35 to constitute thepiezoelectric element unit 30, and the piezoelectric element unit 30 isaligned and fixed to the case 40. At this time, the alignment of thevibrating member 15 (island portion 15 c) of the piezoelectric element35 is performed with an outer peripheral surface of the fixing substrate36 and an inner surface of the piezoelectric element accommodatingportion 43 of the case 40. According to this, the alignment can be moreeasily and accurately performed in comparison to alignment by directlygripping the piezoelectric element 35 formed from a brittle material.

A material that constitutes the fixing substrate 36 is not particularlylimited. However, for example, the fixing substrate 36 may beappropriately constituted with aluminum, copper, iron, stainless steel,or the like. In addition, the flexible printed substrate 50, whichincludes a wiring layer 51 that supplies a signal for driving of thepiezoelectric elements 35, is connected to a surface of thepiezoelectric element 35 on a side opposite to the fixing substrate 36in the vicinity of the base end of the piezoelectric element 35 of thepiezoelectric element unit 30.

The flexible printed substrate 50 consists of a flexible printingcircuit (FPC), a tape carrier package (TCP), and the like. Specifically,for example, the flexible printed substrate 50 has a configuration inwhich the wiring layer 51 having a predetermined pattern is formed withcopper foil and the like on a surface of a base film 52 formed frompolyimide and the like, and a region of the wiring layer 51 other than aregion such as a terminal portion connected to the piezoelectric element35 is covered with an insulating material such as a resist.

In the wiring layer 51 of the flexible printed substrate 50, a base endside thereof is connected to the electrode forming materials 32 and 33,which constitute the piezoelectric element 35, for example, with solder,an anisotropic conductive material, and the like.

On the other hand, a tip end side of the wiring layer 51 is electricallyconnected to the conductive pad 71 of the wiring substrate 70 providedon the case 40. The flexible printed substrate 50 is led out from anopening 72 of the wiring substrate 70 to the outside of thepiezoelectric element accommodating portion 43, and a lead-out region isbent and is connected to the conductive pad 71.

In addition, in the ink jet head 100 of this embodiment, as illustratedin FIG. 4, the piezoelectric element accommodating portion 43 and thespace portion 42 communicate with each other through the communicationchannel 46.

The communication channel 46 is a passage through which thepiezoelectric element accommodating portion 43 and the space portion 42communicate with each other. In this embodiment, the communicationchannel 46 is formed on a bottom surface of the case 40 by removing apart of a surface of the case 40 on a flow channel formed substrate 10side.

In addition, the communication channel 46 of this embodiment is providedat a portion that does not overlap a flow channel including the pressuregenerating chamber 11 in a lamination direction of the flow channelformed substrate 10, the vibrating member 15, and the case 40.Specifically, the communication channel 46 is provided on an outer sideregion in a parallel arrangement direction of the pressure generatingchambers 11 in comparison to the space portion 42 and both ends of thepiezoelectric element accommodating portion 43.

In addition, the communication channel 46 includes a first communicationportion 46 a which continues from the space portion 42 and extends froman end of the space portion 42 in a longitudinal direction thereof to anouter side along the parallel arrangement direction of the pressuregenerating chambers 11, a second communication portion 46 b whichcontinues from the first communication portion 46 a and extends along alongitudinal direction of the pressure generating chambers 11, and athird communication portion 46 c which continues from the secondcommunication portion 46 b, inwardly extends along the parallelarrangement direction of the pressure generating chambers 11, andcontinues to the piezoelectric element accommodating portion 43. Thepiezoelectric element accommodating portion 43 and the space portion 42communicate with each other through the communication channel 46. Inthis embodiment, the communication channel 46 is formed in a surface ofthe case 40 on a flow channel formed substrate 10 side. That is, thecommunication channel 46 is provided as a concave portion in the surfaceof the case 40 on the flow channel formed substrate 10 side.

When the communication channel 46 is provided, the piezoelectric elementaccommodating portion 43 and the space portion 42 constitute a flowchannel through which air flows, and thus a volatile gas inside thespace portion 42 is relatively easily discharged to an outer space.

In the ink jet head 100, a volume of each of the pressure generatingchambers 11 is changed due to deformation of the piezoelectric element35 and the vibrating member 15, and thus ink droplets are ejected fromeach nozzle 21. Specifically, when ink is supplied to the reservoir 13from a liquid storage unit (not illustrated) through the ink introducingchannel 41 that is a liquid introducing channel, the ink is distributedto the pressure generating chambers 11 through the ink supply channel12. In addition, when a voltage is applied to or released from apredetermined piezoelectric element 35 by a drive signal supplied from adrive circuit (not illustrated), the piezoelectric element 35 iscontracted or extended to cause a pressure variation in the pressuregenerating chamber 11, whereby the ink is ejected from the nozzle 21.

The invention may be applied for formation of the joint portion thatjoins constituent members of the above-described ink jet head.

Ink Jet Head Unit, Ink Jet Type Recording Apparatus

Next, an ink jet head unit and an ink jet type recording apparatusaccording to the invention will be described.

FIG. 5 is a schematic view illustrating a preferred embodiment of theink jet type recording apparatus according to the invention.

As illustrated in FIG. 5, the ink jet type recording apparatus 1000includes an ink jet head units (recording head units) 91A and 91B,cartridges 92A and 92B, a carriage 93, an apparatus main body 94, acarriage shaft 95, a drive motor 96, a timing belt 97, and a platen 98.

The cartridges 92A and 92B, which constitute an ink supply unit, aredetachably provided to the recording head units 91A and 91B which areprovided with an ink jet head (recording head) as the joined bodyaccording to the invention as described above, and the carriage 93 onwhich the recording head units 91A and 91B are mounted is provided tothe carriage shaft 95 attached to the apparatus main body 94 in amovable manner along an axial direction. For example, the recording headunits 91A and 91B may set to eject a black ink composition and a colorink composition, respectively.

In addition, when a driving force of the drive motor 96 is transmittedto the carriage 93 through a plurality of gears and a timing belt 97(not illustrated), the carriage 93, on which the recording head units91A and 91B are mounted, moves along the carriage shaft 95. On the otherhand, the platen 98 is provided to the apparatus main body 94 along thecarriage shaft 95, and a recording sheet S, which is a recording mediumsuch as paper fed from a paper feeding roller (not illustrated) and thelike, is transported while being wound around the platen 98.

Hereinbefore, a preferred embodiment of the invention has beendescribed, but the invention is not limited thereto.

For example, in the above-described embodiment, description has beengiven to a configuration in which a continuous process is performedusing a transfer medium and the like which are transported by a roller.However, in the invention, batch processing may be performed.

In addition, in the manufacturing apparatus according to the invention,arrangement of respective constituent elements is not limited to theabove-described arrangement.

In addition, in the above-described embodiment, description has beengiven to a configuration in which different members are used as thefirst heating unit, the second heating unit, and the third heating unit.However, a common heating unit may be used for two or more units amongthe first heating unit, the second heating unit, and the third heatingunit.

In addition, the manufacturing apparatus according to the invention mayinclude a cleaning unit that cleans the transfer medium after transferof the joining material. According to this, the transfer medium can beappropriately and repetitively used, and thus there is an advantage fromthe viewpoints of reduction in production cost of the joined body, andresource saving.

In addition, in the above-described embodiment, description has beengiven to a case in which the invention is applied to joining of twomembers, but the invention may be applied to joining of three or moremembers.

In addition, in the joining method according to the invention, apre-treatment process, an intermediate treatment process, and apost-treatment process may also be performed as necessary.

In addition, in the description, the ink jet head has beenrepresentatively described as the joined body. However, the joined bodyaccording to the invention may be a member other than the ink jet head,and may be appropriately applied, for example, to MEMS, an opticalelement, and the like. These also have a minute structure, and thus theapplication effect of the invention is significantly exhibited.

The entire disclosure of Japanese Patent Application No. 2014-037479,filed on Feb. 27, 2014 is expressly incorporated by reference herein.

What is claimed is:
 1. A joining method, comprising: applying a joiningmaterial including a thermosetting resin to a film, the joining materialjoining a first member and a second member; applying a first heat to thejoining material applied to the film; transferring the joining materialapplied the first heat to the first member; joining the first member andthe second member by the joining material that transferred to the firstmember; and applying a second heat to set the joining material joinedthe first member and the second member, wherein the joining materialincludes an addition-type silicone resin.
 2. The joining methodaccording to claim 1, wherein the joining material includes one or morekinds selected from the group consisting of a methyl-based straightsilicone resin, a phenyl-based silicone resin, and a modified siliconeresin.
 3. An apparatus of manufacturing a joined body, wherein themethod according to claim 2 is executed.
 4. A joined body that ismanufactured using the manufacturing apparatus according to claim
 3. 5.A joined body that is manufactured using the joining method according toclaim
 2. 6. The joining method according to claim 1, wherein a joinedbody is an ink jet head.
 7. An apparatus of manufacturing a joined body,wherein the method according to claim 6 is executed.
 8. A joined bodythat is manufactured using the manufacturing apparatus according toclaim
 7. 9. A joined body that is manufactured using the joining methodaccording to claim
 6. 10. An apparatus of manufacturing a joined body,wherein the method according to claim 1 is executed.
 11. A joined bodythat is manufactured using the manufacturing apparatus according toclaim
 10. 12. The joined body according to claim 11, wherein the joinedbody is an ink jet head.
 13. A joined body that is manufactured usingthe joining method according to claim
 1. 14. The joined body accordingto claim 13, wherein the joined body is an ink jet head.
 15. An ink jethead unit, comprising: the joined body according to claim
 14. 16. An inkjet type recording apparatus, comprising: the ink jet head unitaccording to claim
 15. 17. A joined body that is manufactured using themanufacturing apparatus according to claim
 1. 18. A joining methodaccording to claim 1, wherein a viscosity of the joining material afterthe first heat is applied is higher than a viscosity of the joiningmaterial before the first heat is applied.